1.50mm pitch 90°SMT Wafer Connector Series

90 SMT Wafer Connector Series is a connector series for wafer level packaging with the following features:

1. Small size and high density: The 90 SMT wafer connector series has a small size and high density design to meet the needs of high-end wafer packaging. Their compact design allows them to provide multiple connection points in a limited space, thus realizing high-density connections.Connectors Interconnects

2. High-speed transmission capability: These connector series have excellent high-speed transmission capability to support high-speed signal transmission requirements. This is critical for the modern semiconductor industry where high speed data transmission is required.Cable Assemblies 
3. Low Signal Distortion: The 90 SMT wafer connector series reduces signal distortion during signal transmission and ensures accurate signal transmission, thereby improving system performance and reliability.

4. High Reliability: These connectors utilize high-quality materials and precision manufacturing processes to provide excellent reliability and stability, enabling long-term stable operation in harsh environments.D-sub SCSI DVI RJ45 Connector 

5. Surface Mount Technology: The 90 SMT wafer connector series utilizes surface mount technology and can be soldered directly to the wafer or package substrate, thereby improving productivity and reliability.

6. Multiple pins and arrangements: These connector series usually include different numbers of pins and arrangements to meet the needs of different wafer packages, with a high degree of flexibility and customizability.

7. For high-end wafer packaging technology: 90 SMT wafer connector series are usually used in a variety of high-end wafer packaging technology, such as BGA, CSP, QFN, etc., to meet the needs of these technologies for high density, high-speed transmission, low signal distortion and high reliability.

90 SMT wafer connector series is a very important part of the semiconductor industry, with small size, high density, high speed transmission capability, low signal distortion, high reliability and other characteristics, to meet the needs of high-end wafer packaging.